1.0IRDQhttps://irdq.ca/en/racineincdevhttps://irdq.ca/en/author/racineincdev/rich600338<blockquote class="wp-embedded-content" data-secret="JTAgHRbZCG"><a href="https://irdq.ca/en/project/encapsulation-technology-using-sic/">ENCAPSULATION TECHNOLOGY USING SIC</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://irdq.ca/en/project/encapsulation-technology-using-sic/embed/#?secret=JTAgHRbZCG" width="600" height="338" title="“ENCAPSULATION TECHNOLOGY USING SIC” — IRDQ" data-secret="JTAgHRbZCG" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript"> /* <![CDATA[ */ /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); /* ]]> */ </script> https://irdq.ca/wp-content/uploads/2021/02/sic.elgamal_cwz-2.png170150+EFFICIENT +INTEGRATED Professor El-Gamal successfully demonstrated a thin-film encapsulation technology for above-IC MEMS wafer-level packaging. The uniqueness of this technology lies in its use of SiC as its main structural layer, and the fabrication process is fully CMOS compatible. Many MEMS devices require packaging either for protection only, or to improve performance. Thus, demand and […]