Polishing (1PM52-1)

Polishing (1PM52-1)

Additional information

MANUFACTURER Logitech
MODEL 1PM52-1

Samples

  • Sample size : up to 75 mm (3 in.)

Characteristics

  • Plate rotation speed : 70 rpm maximum
  • Frequency and amplitude controlled eccentric sweep
  • Polishing plate diameter : 30 cm
  • Application: Precision polishing of optical components
  • Materials: Silicon, Fused silicate (High purity grade), Barium BoroSilicate (BK7), Quartz and Aluminum

To use this equipment

The equipment available is accessible to the academic and industrial research community.

To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.

  • This field is for validation purposes and should be left unchanged.