Wafer Saw (DAD3350)

$0.00

Description

Additional information

MANUFACTURER Disco
MODEL DAD3350

Samples

  • Samples size : up to 200 mm (8 in.)
  • Thickness: 10 mm maximum
  • Cutting depth: 7 mm maximum

Characteristics

  • Cutting area : 260 mm X 260 mm
  • Vertical displacement range : 31 mm
  • Positioning precision : 3 µm
  • Lateral precision  : 2 µm
  • Vertical displacement precision : 0,05 µm
  • Vertical repeatability : 1 µm
  • Blade rotating speed : from 3 000 to 30 000 rpm
  • Cutting speed : 600 mm/s with feedback control
  • Angle of rotation : 360° with feedback control

Materials

  • Glass
  • Quartz
  • Ceramics
  • Silicon
  • GaAs

Additional information

MANUFACTURER

Disco

MODEL

DAD3350