Aligner (200)
Aligner (200)
Additional information
| MANUFACTURER | OAI |
|---|---|
| MODEL | 200 |
Samples
- Photomasks sizes : 127 mm maximum
- Samples sizes : 10 mm to 100 mm
Characteristics
- Spectral selection : Near UV or far UV (wide spectrum)
ROUTINE PROCESS
Contact mode Photolithography
On : positive resists
- Minimum feature size : 1 µm
- Resist thickness : 0.5 µm to 2 µm
ROUTINE PROCESS
Contact mode Photolithography
On : negative resists
- Minimum feature size : 5 µm
- Resist thickness : 5 µm to 1000 µm
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To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.