Bonder
Bonder
Additional information
| MANUFACTURER | SUSS Microtec |
|---|---|
| MODEL | SB6E |
Samples
- Sample size: 25 mm to 150 mm (6 in.)
- Thickness: 2 mm minimum
Characteristics
- Temperature : ambient to 500 °C
- Pressure: atmospheric to 5×10-5 mBar
- Alignment precision : 1 µm
- Applied forces : 300 N to 20 kN
- From a mask aligner (equipment MA6 from Suss Microtec), the alignment is performed via an optical method (4 CCD cameras)
TYPES OF BONDING
- Fusion bonding, glass frit bonding, direct bonding, polymer adhesive,. metal eutectic bonding, anodic bonding, diffusion bonding
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.