Bonder

$0.00

Description

Additional information

MANUFACTURER SUSS Microtec
MODEL SB6E

Samples

  • Sample size: 25 mm to 150 mm (6 in.)
  • Thickness: 2 mm minimum

Characteristics

  • Temperature : ambient to 500 °C
  • Pressure: atmospheric to 5×10-5 mBar
  • Alignment precision : 1 µm
  • Applied forces : 300 N to 20 kN
  • From a mask aligner (equipment MA6 from Suss Microtec), the alignment is performed via an optical method (4 CCD cameras)

 

TYPES OF BONDING

  • Fusion bonding, glass frit bonding, direct bonding, polymer adhesive,. metal eutectic bonding, anodic bonding, diffusion bonding

Additional information

MANUFACTURER

SUSS Microtec

MODEL

SB6E