Tescan Feras 3XM

General description:

Micro machining with a high performance Xenon focus ion beam coupled with a SEM for real time imaging of the cut.

Characteristics :

• Tescan Mira-3 High Resolution Schottky Field Emission Scanning Electron Microscope (FESEM) Column
• Fully integrated Orsay Physics Plasma Xe source Focused Ion Beam(FIB) column
• MultiGIS Gas Injection System for Pt deposition
• Tescan Wide Field Optics 3-lens electron optics, providing dedicated scanning and imaging modes for High Resolution, Wide Field ultra-low “macro” imaging, High Depth of Focus Imaging, live 3D stereo imaging, and selected area electron channeling (crystallographic) imaging from grains down to 20 μm.
• 200V – 30kV Accelerating Voltage range in 10V steps
• High resolution imaging, 1.2 nm at 30 kV (SE), 2 nm at 30 kV (BSE)
• Full 16-bit Image Acquisition and Scanning System, allowing acquisition of digital images up to 8, 192 x 8,192 pixels (64-Megapixels) with user-specified image aspect ratios of 1:1, 4:3 and 2:1
• Ultra-wide FESEM magnification range from 2x to 1,000,000x
• Large XM specimen chamber, 300mm x 330mm internal dim., 280mm x 310mm door opening, 11+ports
• Heavy-duty 5-axis fully motorized and computer controlled specimen stage, x=130mm, y=130 mm, z=100mm, R=360˚, and tilt=-30˚ to + 90˚, Weight capacity =8Kg
• Tescan Loadlock, fully integrated into the automatic vacuum system of the microscope, minimum 80mm sample exchange
• Fully Integrated Halcyonics Active Vibration Cancellation System
• Fully automatic vacuum system including a clean 2-stage turbomolecular pump with magnetic high vacuum bearings and a completely dry, lubricant-free scroll pump
• Evehart-Thornley Secondary Electron Detector with single-Crystal Yag scintillator