Wafer Saw (DAD3350)
Wafer Saw (DAD3350)
Additional information
| MANUFACTURER | Disco |
|---|---|
| MODEL | DAD3350 |
Samples
- Samples size : up to 200 mm (8 in.)
- Thickness: 10 mm maximum
- Cutting depth: 7 mm maximum
Characteristics
- Cutting area : 260 mm X 260 mm
- Vertical displacement range : 31 mm
- Positioning precision : 3 µm
- Lateral precision : 2 µm
- Vertical displacement precision : 0,05 µm
- Vertical repeatability : 1 µm
- Blade rotating speed : from 3 000 to 30 000 rpm
- Cutting speed : 600 mm/s with feedback control
- Angle of rotation : 360° with feedback control
Materials
- Glass
- Quartz
- Ceramics
- Silicon
- GaAs
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.