Wire bond
Wire bond
| MANUFACTURER | Hesse Mechatronics |
|---|---|
| MODEL | BJ653 |
General description:
Electrical connection between the chip and the substrate via gold or aluminum thin wire/ribbon or heavy aluminum round wire.
Characteristics :
- Automatic mode
- Working area (x, y, z) : 100 x 115 x 42 mm
- Axis accuracy : ±10 µm
- Heated working area up to 200°C
- Bond head rotation : 440°
- DA07 bond head : thin wire, deep access
- Round wire Au, Al : 17.5µm – 50µm
- Ribbon Au, Al : 6×35µm – 25×250µm
- 2 inch spools
- HBK10 bond head : heavy round wire
- Round wire Al : 50µm – 500µm
- 2-8 inch spools
- Ebox option included
- Field of view : 6×8 mm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.