Wire Bonding
Wire Bonding
Additional information
| MANUFACTURER | Kulicke Soffa |
|---|---|
| MODEL | KS4523 |
Samples
- Surface covered: 134 mm x 134 mm
Characteristics
- Manual or semi-manual
- Soldering by ultrasonic (1.3 W or 2.5 W)
- Wire diameter:
- Gold from 13 µm to 76 µm
- Aluminum: from 20 µm to 76 µm
Related products
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.