Struers, Buehler, ATM, Leco, Allied High Tech, SBT
Struers, Buehler, ATM, Leco, Allied High Tech, SBT
| MANUFACTURER | Struers, Buehler, ATM, Leco, Allied High Tech, SBT |
|---|---|
| MODEL | Manual, automatic, from 8 to 12 inches platen |
General description:
Cutting, mounting, grinding & polishing micro electronic parts for characterisation and/or failure analysis.
Characteristics :
Cutting
- Rough cutting max sample size :50 X 50 cm
- Precision cutting : 160 X 50 mm / 70 mm Dia.
- Low peed : max dia. 30 mm
- Wire saw : 45 X 45 X 20 mm (max. sample size)
Mounting
- Cold mounting
- clear epoxy 8 hour cure room temp. (very low shrinkage)
- Acrylic 10 min. cure room temp.
Grinding / polishing (wet or dry) up to 12 inches platen
- Grinding
- Maxi sample size: 3 inches Ø or 3 inches x 4 inches rectangular, 2 inches high
- SiC, diamond, diamond Lapping film, (wet or dry)
- Back side delayering
- Precision grinding
- High removal rate
Polishing
- Diamond , Al2O3, Colloidal silica, lapping film
- Automatic preparation
- Precision down to 1µm (small sample size)
- Large sample size (special tooling may be required)
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.