Plasma etch
Plasma etch
| MANUFACTURER | PVA Tepla |
|---|---|
| MODEL | GIGAbatch 690 |
General description:
Cleaning of advanced chip packages using oxygen or argon plasma
Characteristics :
Process chamber:
- Material Aluminum
- Volume 91 liters
- Inner dim. 450 x 450 x 450 mm ( H x W x D)
- Plasma generation and gas flow: Large area, microwave plasma generation
- No electrodes inside chamber
- Gas flow variable depending of application
- Plasma generation through right side chamber wall
- Exhaust in left side chamber wall
- Vacuum system: Ultimate pressure ≤ 10 -1 mbar
- Process pressure approx. 0,2 – 1,5 mbar
- Microwave plasma generator: Continuously adjustable magnetron, air cooled
- Frequency 2.45 Gigahertz
- Maximum output 1000 Watts
- Rotating platform:
- Material Aluminum, 350 mm Ø
- Electrical drive starts after the process chamber is closed
- Mass flow controller, up to 4 gaz channels possible. Currently O2 and Argon
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.