Horizontal spraying
Horizontal spraying
| MANUFACTURER | KDF Electronics & Vacuum Services Inc. |
|---|---|
| MODEL | 943 GT |
General description:
Process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles, commonly utilized for thin film deposition.
Characteristics :
- Surface free from contact point
- Chamber dimension 7 x 23 x 69.5 inches ( D x H x W )
- Pallet dimension 13 x 13 inches
- Pellet height up to 2 inches
- High vacuum pump ≤ 2×10-7 Torr
- Radiant heater loadlock
- Up to 3 Cathodes 12 x 37.8 cm
- RF generator 1.5 KW (optional 3 KW)
- DC Magnetron power supply 10 KW adjustable to 850V or 30 Amp
- Scan speed (bi-directional) 2 to 400 cm/min
- Etch level 0.1 to 1.5 KW
- Deposition thickness uniformity across pallet for 1µm aluminum
- +/- 5 % Planar using high uniformity magnets (DC or RF)
- +/- 10% Planar using high utilization magnets (DC or RF)
- Deposition thickness uniformity pallet to pallet +/- 5% all cathode type
- Etch uniformity (with movable shutters)
- Wafer to wafer +/- 7%
- Across a wafer +/- 10%
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.