Maskless Aligner
Maskless Aligner
| MANUFACTURER | Screen Semiconductor Solutions Co. Ltd |
|---|---|
| MODEL | DW-3000 |
General description:
Maskless direct-write lithography
Our DW-3000 maskless alignment system achieves a throughput of more than 30 wafers per hour (1 laser head). Since this equipment does not use physical masks, it offers great flexibility, allowing for the management of manufacturing processes from one wafer to the next. It can compensate for global and local distortions on wafers in real time and also provide complete traceability for each mask (lot number, wafer number, mask number, etc.).
Screen uses laser control technology developed over many years to project high-power laser beams with high precision onto the GLV™. This impressive technology enables the simultaneous control of 8,000 laser beam channels. As a result, high-speed synchronization is possible, enabling high-speed, high-precision imaging. This equipment is the first to feature maskless technology, offering “production capacity.”
Characteristics :
- Resolution 3 μm (L/S)
- Exposure method Direct imaging (raster scanning method)
- Reduction ratio 1:10
- NA (numerical aperture) 0.1
- Exposure light source 16 W YAG laser (near i-line:355 nm)
- Wafer size 200 mm
- Overlay accuracy Top surface alignment : ≤ 1 μm (|M| + 3 σ)
- Back side alignment (InfraRed) : ≤ 1 μm (|M| + 3 σ)
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.