Description
Additional information
| MANUFACTURER | Oxford Instruments |
|---|---|
| MODEL | PlasmaLab System 100 – Modular ICP380 |
Samples
- Photomasks sizes : maximum 150 mm (6ˮ); thickness: maximum 6,35 mm (1/4ˮ)
- Samples sizes : maximum 150 mm (6ˮ); thickness: maximum 6,35 mm (1/4ˮ)
Available Temperatures and Gases
- Temperature : -150 °C to 400 °C
- Gases: Cl2, O2, SiCl4, CH4, He, SF6, H2, N2, Ar
Characteristics
- High density 380 mm ICP Source (Generator of 2 MHz, 5 kW)
- 240 mm lower electrode (13.56 MHz, 600 W) with automatic impedance tuning and variable height
- Typical operating pressure: 1 – 100 mTorr
- Fast loading via loadlock
- Etch end point detection system by laser interferometry
- Automated chamber cleaning
- Cryogenic platform
ROUTINE PROCESS
Etch
Metal Etch
- Types of metal: Cr, Al
- Minimum feature size: 30 nm
- Etch masks: SiO2 or resist
- Etch rate: about 50 nm/min
ROUTINE PROCESS
Etch
III-V Material Etch
- Type of material: GaAs, GaN, InGaN
- Minimum feature size: 50 nm
- Etch masks: SiO2 or resist
- Etch rate: about 350-700 nm/min
