Aligner (200)

$0.00

Description

Additional information

MANUFACTURER OAI
MODEL 200

Samples

  • Photomasks sizes : 127 mm maximum
  • Samples sizes : 10 mm to 100 mm

Characteristics

  • Spectral selection : Near UV or far UV (wide spectrum)

 

ROUTINE PROCESS

Contact mode Photolithography

On : positive resists

  • Minimum feature size : 1 µm
  • Resist thickness : 0.5 µm to 2 µm

 

ROUTINE PROCESS

Contact mode Photolithography

On : negative resists

  • Minimum feature size : 5 µm
  • Resist thickness : 5 µm to 1000 µm

Additional information

MANUFACTURER

OAI

MODEL

200