Chip placement Datacon
Chip placement Datacon
| MANUFACTURER | Datacon |
|---|---|
| MODEL | EVO 2200 |
General description:
Automated multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate
Characteristics :
- JEDEC tray input/output
- Accuracy +/- 10 µm @ 3 sigma, cpk 1.33
- Theta axis rotary bond head 0˚ to 360˚ increments 0.0045˚
- Theta placement accuracy +/- 0.15˚ @ 3 sigma
- Automatic calibration function corrects thermal changes over time
- Multi-chip placement in one single pass capability
- Picking from wafer ( 4 to 12 in.) on 12 in. frame
- (Or waffle pack / GEL PAK ( 2 x 2 in.)
- Wafer table with stretcher
- 7 positions automatic tool changer unit
- SECs/GEM capability
- Wafer scanner and electronic wafer mapping capable
- Pattern recognition system with edge, gray level, pattern and ink dot
- Wafer size 50 to 300 mm
- Frame size 375 mm
- Die size 0.5 mm to 50 mm
- Die thickness 0.05 to 7 mm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.