Wafer Dicing
Wafer Dicing
| MANUFACTURER | Disco Corporation |
|---|---|
| MODEL | DFD 6362 |
General description:
Cut wafer at various chip size
Characteristics :
- Irregular slices up to 300mm with solder balls or wire solder site
- Slices of glass, ceramics, overlays, SiC, Sapphire, etc.
- Edge cutting function
- Integrated automatic options :
- CO2 injector
- Washing station
- UV exposure
- High-speed rotation up to 2.2kW/80K RPM
- 2-inch blade hub or hubless blade
- Positioning accuracy: 4µm
- Standard cassette 10 slot 300 mm /frame FF123
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.