Wafer thinning
Wafer thinning
| MANUFACTURER | Accretech |
|---|---|
| MODEL | PG3000 RM |
General description:
Thin up 200 / 300 mm wafer down to 50 µm (75µm with C4)
Characteristics :
- Ultra-thin automated wafer handling
- Automatic peeling and dicing frame (FF123) mounting
- Chemical/Mechanical polishing station 0.15 µm roughness
- TTV without device protection tape and resist film 2.5 µm
- Non-contact probe for thickness measurement
- Cleanliness:, chuck cleaning, pre/post BG tape cleaning
- Wafer handling hand and pad cleaning
- Wafer mounting accuracy for centering within 0.5 mm
- Notch accuracy for dicing frame within 0.5 deg
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.