High vacuum cure oven
High vacuum cure oven
| MANUFACTURER | Yield Engineering Systems Inc. |
|---|---|
| MODEL | YES-450PB 8-2P-CP |
General description:
Polyimide Bake
Characteristics :
- Handling wafer with diameter up to 200 mm
- Maximum batch of 50 200 mm wafers
- Chamber Cleanliness of Class 1
- Maximum temperature of 450 Celsius
- Pressure of operation at 250 Torrs
- Temperature uniformity +/- 5 Celsius during dwell after stabilization period
- Maximum heat-up rate of 7.5 Celsius per minute
- Maximum cool-down rate of 4.5 Celsius per minute
- Nitrogen environment: Oxygen concentration of 10 ppm over background
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.