Laser Photolithography
Laser Photolithography
Additional information
| MANUFACTURER | Heidelberg |
|---|---|
| MODEL | DWL-66FS |
Samples
- Photomask size : 152 mm (6 in.) maximum
- Sample size : 152 mm maximum
- Thickness : 10 mm maximum
Characteristics
- Alignment precision: from 200 nm to 2000 nm (according to the resolution)
- Laser diode, wavelength: 405 nm
- Writing speed: from 1 mm²/min to 290 mm²/min (according to the resolution)
ROUTINE PROCESS
Photolithography
On negative resist
- Minimum feature size : 2 µm
- Thickness : from 1 µm to 3 µm
ROUTINE PROCESS
Photolithography
On positive resist
- Minimum feature size : 1 µm
- Thickness : from 1.5 µm to 7 µm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.