Thermal paste dispense
Thermal paste dispense
| MANUFACTURER | NORDSON ASYMTEK |
|---|---|
| MODEL | S-910N |
General description:
Fluid dispensing
Characteristics :
- Underfill for flip chip and chip scale packaging
- Chip encapsulation
- Dam and fill
- Thermal compounds
- Exterior bulk fluid reservoir
- Tactile height sensor
- Programmable fluid and valve pressure control
- Digital vision system
- X-Y placement accuracy : ±0.050 mm @ 3 sigma
- Z repeatability : ±0.025 mm
- X-Y repeatability : ±0.025 mm
- Dispense area : 339 x 410 mm
- Camera’s field of view: 7.0 x 5.0 mm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.