Wafer Saw (ADT 7100 Provectus)
Wafer Saw (ADT 7100 Provectus)
Additional information
| MANUFACTURER | Advanced Dicing Technology |
|---|---|
| MODEL | ADT 7100 Provectus |
Samples
- Samples size : up to 200 mm (8 in)
- Blade size: 50 mm (2 in) and 75 mm (3 in)
Characteristics
- Resolution: 0.2 µm
- Precision : 2 µm
- Blade rotating speed : 60 krpm, 1.2 kW (rotation by compressed air)
- Cutting speed : 600 mm/s
- Blades: resin, hubbed nickel bond…
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.