ENCAPSULATION TECHNOLOGY USING SIC

ENCAPSULATION TECHNOLOGY USING SIC

+EFFICIENT +INTEGRATED Professor El-Gamal successfully demonstrated a thin-film encapsulation technology for above-IC MEMS wafer-level packaging. The uniqueness of this technology lies in its use of SiC as its main structural layer, and the fabrication process is...
BASIC DATA FOR THE FABRICATION OF RESONATORS

BASIC DATA FOR THE FABRICATION OF RESONATORS

+PRECISE +EFFICIENT +INTEGRATED To fabricate a high-quality MEMS resonator, it is essential to know the damping properties of its components, notably those related to internal friction in thin films (50 to 500 nm thick). For the first time, professors Vengallatore and...