Wafer inspection (scanner)
Wafer inspection (scanner)
| MANUFACTURER | Rudolph Technologies, Inc. |
|---|---|
| MODEL | WS3880 |
General description:
Automated wafer inspection prior to dicing
Characteristics :
- Automatic slice support:
- 200 and 300mm
- Thickness from 800µm to 190µm
- Maximum number of bump / slice: 10 million
- 2D optical detection: 5µm
- 3D laser detection: 0.125µm, 4 MHz data acquisition rate
- Depth of field: 28µm (2D), 200µm (3D)
- Very high resolution 3D detector: 5µm
- 5-position lens turret: 1.25X, 2X, 5X, 10X)
- Bright and dark field lighting
- 2D metrology and bump fault detection
- 3D measurement of height and coplanarity of bumps
- Electronic slice mapping
- Integrated ISO class 2 filtration unit
- Remote computer fault review
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To use this equipment
The equipment available is accessible to the academic and industrial research community.
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