Stealth Dicer

Stealth Dicer

MANUFACTURER Disco
MODEL DFL7340

General description:

Laser Stealth dicing of Si wafers

Characteristics :

Applications field : 

  • Contact-less dicing of Silicon wafers 
  • PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing 

 Specifications : 

  • Fully automated mode 
  • Process Wavelength: IR 
  • 200mm wafers or smaller (6in, 4in, 3in, coupon, wafer quarter) 
  • Up to 1.5 mm thick wafers 
  • Multi-projects wafers (MPW) dicing capabilities 
  • IR camera for back side alignment 
  • X-axis & Y-axis: 
    • Feeding speed: 1.0 – 1000 mm/s 
    • Position accuracy: 3µm 
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The equipment available is accessible to the academic and industrial research community.

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