Chip placement Panasonic

General description:

Automated high precision multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate

Characteristics :

• JEDEC tray input/output
• Accuracy +/- 3 µm @ 3 sigma cpk 1.33
• Automatic calibration function to correct thermal changes over time
• Simultaneous recognition camera with temperature control
• Chip  to substrate and chip to wafer capable
• Placement head for flip chip
• Thermo compression head available
  • Bonding pressure 5N – 490N
  • 4 points parallelism  adjustment system
  • Bonding head temperature up to 500˚ C
  • Heated bonding stage JEDEC format up to 250˚C
• Ceramic heated bonding stage for 300 mm wafer up to 200˚C
• Multi-chip placement in one single pass capability
• Flux dipping station
• Die pick from wafer (up to 12 inches), waffle pack or GEL-PACK ( 2 x 2 inches)
• Wafer table with stretcher
• 2 positions automatic tool changer unit
• SECs/GEM capability
• Wafer scanner  and electronic wafer mapping capable
• Pattern recognition system with edge, gray level, pattern and ink dot
• Wafer size  150/200/300 mm on 300 mm wafer frame
• Max quantity/wafer x=200 chips, y=200 chips
• Frame size  375 mm
• Die size  1 mm to 35 mm
• Die thickness  0.05 to 7 mm