Aligner (200)
Aligner (200)
Additional information
| MANUFACTURER | OAI |
|---|---|
| MODEL | 200 |
Samples
- Photomasks sizes : 127 mm maximum
- Samples sizes : 5 mm to 75 mm
Characteristics
- Spectral selection : Broadband, I-Line, G-Line
ROUTINE PROCESS
Contact mode Photolithography
On : positive resists
- Minimum feature size : 0.7 µm
- Resist thickness : 0.45 µm to 30 µm
On : negative resist
- Minimum feature size : 1 µm
- Resist thickness : 1.5 µm to 5 µm
On : SU8
- Minimum feature size : –
- Resist thickness : 0.5 µm to 30 µm
On : image reversal resist
- Minimum feature size : 1.5 µm
- Resist thickness : 1.5 µm to 3 µm
ROUTINE PROCESS
Soft contact Photolithography
On : positive resists
- Minimum feature size : 2 µm
- Resist thickness : 0.45 µm to 30 µm
On : negative resist
- Minimum feature size : 2 µm
- Resist thickness : 1.5 µm to 5 µm
On : SU8
- Minimum feature size : 3 µm
- Resist thickness : 0.5 µm to 30 µm
On : image reversal resist
- Minimum feature size : 2 µm
- Resist thickness : 1.5 µm to 3 µm
Other routine process
- Photolithography on photosensitive films deposited via lamination. This makes possible the use of much thicker resists, up to 100 µm.
Related products
To use this equipment
The equipment available is accessible to the academic and industrial research community.
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