Description
Additional information
| MANUFACTURER | OAI |
|---|---|
| MODEL | 200 |
Samples
- Photomasks sizes : 127 mm maximum
- Samples sizes : 5 mm to 75 mm
Characteristics
- Spectral selection : Broadband, I-Line, G-Line
ROUTINE PROCESS
Contact mode Photolithography
On : positive resists
- Minimum feature size : 0.7 µm
- Resist thickness : 0.45 µm to 30 µm
On : negative resist
- Minimum feature size : 1 µm
- Resist thickness : 1.5 µm to 5 µm
On : SU8
- Minimum feature size : –
- Resist thickness : 0.5 µm to 30 µm
On : image reversal resist
- Minimum feature size : 1.5 µm
- Resist thickness : 1.5 µm to 3 µm
ROUTINE PROCESS
Soft contact Photolithography
On : positive resists
- Minimum feature size : 2 µm
- Resist thickness : 0.45 µm to 30 µm
On : negative resist
- Minimum feature size : 2 µm
- Resist thickness : 1.5 µm to 5 µm
On : SU8
- Minimum feature size : 3 µm
- Resist thickness : 0.5 µm to 30 µm
On : image reversal resist
- Minimum feature size : 2 µm
- Resist thickness : 1.5 µm to 3 µm
Other routine process
- Photolithography on photosensitive films deposited via lamination. This makes possible the use of much thicker resists, up to 100 µm.
