Aligner (EVG 620)
Aligner (EVG 620)
Additional information
| MANUFACTURER | EV Group |
|---|---|
| MODEL | EVG 620 |
Samples
- Photomasks size : 178 mm (7 in.) maximum
- Samples size : 150 mm maximum
Caracteristics
- Source : Mercury lamp 1 000 W
- Spectral selection : I-line
- Optics: Dielectric mirror mid-range UV (350 nm – 450 nm)
- Wavelength selection possible via pass-band filter
- Exposure mode : proximity, contact or under vacuum, UV-Nanoimprint
- Alignment: with CCD camera, programmable from front or back side
- Alignment precision : 0.5 µm with 20 X lens
ROUTINE PROCESS
Contact mode Photolithography
On : positive resists
- Minimum feature size : 0.6 µm
- Resist thickness : 0.5 µm to 10 µm
On : SU8
- Minimum feature size : –
- Resist thickness : 1 µm to 200 µm
ROUTINE PROCESS
Contact mode Photolithography
On : negative resists
- Minimum feature size : 0.7 µm
- Resist thickness : 0.7 µm to 10 µm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.