Discrete component placement
Discrete component placement
| MANUFACTURER | Kulicke & Soffa |
|---|---|
| MODEL | IConn ProCu PLUS LA |
General description:
Make the electric connexion between the chip and the substratum with a gold or a copper wire.
Characteristics :
- Fully automatic wire bonder
- Cassette in/out
- Typical ultra-fine pitch ball grid array product
- 35µm minimum pad pitch
- 2µm @ 3 sigma accuracy
- Minimum 0.6 mils Ø wire
- Extra large 56mm X 87mm bond area
- Copper wire option with forming gas
- Advanced node wafers down to 28nm or below
- Wire pull and ball shear available for process development/control
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.