Description
Additional information
| MANUFACTURER | Ambios |
|---|---|
| MODEL | XP-2 |
Analyses
- Sampled depth: up to 50 nm
- Samples thickness: 30 mm max, vertical range: 400 µm max
- Vertical resolution: 1 Å to 10 µm, 15 Å to 100 µm
- Lateral resolution: 100 nm
Applications
- Dimensional characterization (height, width) of etch or lithographic features
- Thin films stress measurement
- Surface roughness characterization
Characteristics
- Motorized 150 mm x 178 mm stage
- Maximum length of a single scan: 60 mm; ability of digitally stitch scans up to 150 mm
- Stylus force: programmable from 0.5 mg to 10 mg
- Software for 3D rendering and stress measurement
- Scan data digitally stored
- Colour CCD camera with 40x to 160x motorized zoom
- Anti-vibration table (Herzan DT-6050MV)
- Removable 200 mm support for wafer stress measurement
- NIST certified step height standards of 1 µm and 100 nm
- 40 degree stylus of 2, 1 and 0.2 µm
