Laser ablation 2
Laser ablation 2
| MANUFACTURER | Advanced Laser Separation International |
|---|---|
| MODEL | ICA 1204 |
General description:
Active chip circuitry ablation and cutt
Characteristics :
- 365 nm multi-beam UV lamp
- Single-pass groove 60 µm wide
- Sample thickness capacity up to 1.5 mm
- Cutting capacity up to 300 µm thick
- Sample types:
- Multiple chip sizes on a single wafer
- Broken wafer
- Laser cutting of wafer edges
- Integrated cleaning and coating stations
- Positioning accuracy: 2 µm
- Maximum speed of x and y axes: 500 mm/s
- Frame type: FF123Surface cleaning to enhance adhesion
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.