Electrodeposition of metal and dielectric
Electrodeposition of metal and dielectric
| MANUFACTURER | Scientific Value Solutions Corp. (SVS) |
|---|---|
| MODEL | JikJi-77 |
General description:
Through Silicon Via filling of copper and Au-Sn
Characteristics :
- Wafer size: 200 mm
- Thickness range of wafers: 300 – 1200 µm
- Wafer material: Silicon, Glass
- Fully qualified for through silicon via AquiViaTM process under license from Alchimer, with the following modules:
- Module 1: Pre-wetting of Si wafers with 20:1 aspect ratio vias
- Module 2: Chemical grafting of 0.2-1.0 µm insulation film
- Module 3: Activation of insulation for Ni(B)
- Module 4: Electroless Ni(B) diffusion barrier
- Module 5: Cu electrofill in 50:5µm & 100:5µm TSV
- Module 6: Wafer annealing
- Module 7: 80Au/20Sn eutectic electroplating
To use this equipment
The equipment available is accessible to the academic and industrial research community.
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