Laser Ablation Deposition

$0.00

Description

Additional information

MANUFACTURER PVD
MODEL 3000

Samples

  • Sample sizes: from 10 mm to 75 mm (3 in.)
  • Temperature: ambient to 950 °C
  • Pressure: 10-8 Torr to 500 mTorr
  • Wafer Uniformity: 5%

Characteristics

  • Totally automated system
  • Laser source: PulseMaster 866 from Light Machinery (from 500 mJ and up to 100 Hz)
  • Available gases: O2, Ar, He and N2
  • Target to substrate distance adjustable from 65 to 130 mm
  • Automated raster scan system allowing homogeneous depositions over an area up to 3 in.
  • Graphical User Interface with automated tools control and optional saving of process recipes
  • Load lock allowing samples entry and exit without re-exposing the ablation chamber to air
  • Carousel system allowing to use up to 3 different targets for multilayer deposition without re-exposure to air

 

ROUTINE PROCESS

Deposition

Simple materials

  • Al, Pt…
  • Thickness : from 10 nm to ~µm (depending on film stress)

Oxydes

  • BST, CBN…
  • Thickness : from 10 nm to ~µm (depending on film stress)

Additional information

MANUFACTURER

PVD

MODEL

3000