Profilometry (XP-2)
Profilometry (XP-2)
Additional information
| MANUFACTURER | Ambios |
|---|---|
| MODEL | XP-2 |
Analyses
- Sampled depth: up to 50 nm
- Samples thickness: 30 mm max, vertical range: 400 µm max
- Vertical resolution: 1 Å to 10 µm, 15 Å to 100 µm
- Lateral resolution: 100 nm
Applications
- Dimensional characterization (height, width) of etch or lithographic features
- Thin films stress measurement
- Surface roughness characterization
Characteristics
- Motorized 150 mm x 178 mm stage
- Maximum length of a single scan: 60 mm; ability of digitally stitch scans up to 150 mm
- Stylus force: programmable from 0.5 mg to 10 mg
- Software for 3D rendering and stress measurement
- Scan data digitally stored
- Colour CCD camera with 40x to 160x motorized zoom
- Anti-vibration table (Herzan DT-6050MV)
- Removable 200 mm support for wafer stress measurement
- NIST certified step height standards of 1 µm and 100 nm
- 40 degree stylus of 2, 1 and 0.2 µm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about usage conditions and availability, please fill out the form below. After reviewing your request, we will contact you shortly to offer you the best available solution.