Profilometry (XP-2)

Description

Additional information

Analyses

• Sampled depth: up to 50 nm
• Samples thickness: 30 mm max, vertical range: 400 µm max
• Vertical resolution: 1 Å to 10 µm, 15 Å to 100 µm
• Lateral resolution: 100 nm

Applications

• Dimensional characterization (height, width) of etch or lithographic features
• Thin films stress measurement
• Surface roughness characterization

Characteristics

• Motorized 150 mm x 178 mm stage
• Maximum length of a single scan: 60 mm; ability of digitally stitch scans up to 150 mm
• Stylus force: programmable from 0.5 mg to 10 mg
• Software for 3D rendering and stress measurement
• Scan data digitally stored
• Colour CCD camera with 40x to 160x motorized zoom
• Anti-vibration table (Herzan DT-6050MV)
• Removable 200 mm support for wafer stress measurement
• NIST certified step height standards of 1 µm and 100 nm
• 40 degree stylus of 2, 1 and 0.2 µm